A Mixed Approach for Solving Volume-Surface Integral Equations in the Analysis of Microstrip Antenna and Packaging Structures
A Mixed Approach for Solving Volume-Surface Integral Equations in the Analysis of Microstrip Antenna and Packaging Structures
Publisher
IEEE Transactions on Components, Packaging and Manufacturing Technology
Date Issued
2017
Program
面上项目
Project ID
61271097
Sponsorship
电磁波与压电陶瓷材料相互作用研究
Institution
同济大学
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http://or.nsfc.gov.cn/handle/00001903-5/489058
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